مدلسازی سه بعدی دینامیک سیالات محاسباتی سیستم سرمایشی پایین زن در یک مرکز داده نمونه

[1]  American Society of Heating Refrigerating and Air-Conditioning Engineers (ASHRAE), Datacom Equipment Power Trends and Cooling Applications, TC 9.9 Committee, Atlanta, GA, 2005.

[2]  American Society of Heating Refrigerating and Air-Conditioning Engineers (ASHRAE), Thermal guidelines for data processing environments expanded datacenter classes and usage guidance, American Society for Heating, Refrigeration and Air Conditioning, Atlanta, Georgia.

[3]  Patel C.D., Bash C., Belady C., Stahl L., Sullivan D, Computational fluid dynamics modeling of high compute density data centers to assure system inlet air specifications, The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition,IPACK2001-15622,2001.

[4]  Patel C.D., Sharma R., Bash C., Beitelmal M, Thermal considerations in cooling of large scale high compute density data centers, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 767e776, 2002.

[5]  Schmidt R., Karki K.C., Patankar S.V, Raised data center: Perforated tile flow rates for various tile layouts, 9th Intersociety Conference on Thermal and Thermo mechanical Phenomena in Electronic Systems, 2004.

[6]  Schmidt R., Karki K.C., Kelkar K.M., Radmehr A., Patankar S.V, Measurements and predictions of the flow distribution through perforated tiles in raised floor data centers, The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition, 2001, IPACK2001-15728.

[7]  Radmehr A., Schmidt R., Karki K.C., Patankar S.V, Distributed leakage flow in raised-floor data centers, The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition, IPACK2005-73273, 2005.

[8]  Van Gilder J.W., Schmidt R, Airflow uniformity through perforated tiles in a raised-floor data center, The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition, IPACK2005-73375, 2005.

[9]  Rambo J, Joshi Y., Modeling of data center airflow and heat transfer: state of the art and future trends. Distributed and parallel database, special issue on high density data centers, Vol. 21, pp 193–22, 2007

[10]             U.S. Department of Energy, U.S. Data Centers save Energy Now, Industrial Technologies Program, DOE-Energy Efficiency and Renewable Energy, 2009.

[11]             Chao Lyu, Guangming Chen, Shuiquan Ye, Yueqin Liu, Enclosed aisle effect on cooling efficiency in small scale data center, 0th International Symposium on Heating, Ventilation and Air Conditioning, ISHVAC2017, Jinan, China, 19-22 October 2017.

[12]             Yogendra Joshi, Pramod Kumar, Energy efficiency Thermal management of Data Centers, chapter 8,pp 335-382, springer, ISBN 978-1-4419-7123-

[13]             Cho J.,  Shin S., Power and heat load of IT equipment projections for  new data center’s HVAC  system design, Journal of  the Society of  Air-conditioning and Refrigerating Engineers of Korea , Vol.24 (3), pp 212–217,2013.